RF board with SMPS

OUTSTANDING !!! Three controlled-impedance paths (USB 480 Mbit/s, RF1 at 2.5 GHz, and RF2) were successfully verified using both a VNA and a spectrum analyzer. Components such as QFN and BGA packages were soldered flawlessly, as confirmed by CT scan inspection. Small passive components in sizes ranging from 0201 to 0603 were also soldered perfectly—even without thermal relief, due to RF and SMPS constraints. The PCB features a custom stack-up, ENIG surface finish with through-hole plating, and 0.2 mm drill sizes. The black matte solder mask gives the board an excellent appearance. Overall, the build quality is perfect.



Jun 01,2026
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PCB
HDI PCB
Assembly
FPC/
Rigid-Flex
X
Choose Num (pcs)
2 Layers
1.6mm
CNC
Machining
Sheet Metal
3D Printing
Injection
Molding
Aluminum
Aluminum
Resin
ABS
Libor Bubla View Profile
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